S3STM500HIRHSF1

S3STM500HIRHSF1
965.72 /
  • Color: Black
  • Height (in): 1.4
  • Height H2 (in): 2.2
  • Hole Diameter (in): 0.5 - 0.54
  • Length (in): 2
  • Material: Polyamide 6.6, High Impact Modified, Heat Stabilized
  • Max Cable Tie Width: 0.51
  • Max. Bundle Dia. (in): 5
  • Max. Bundle Dia. 1st Hole (in): 5
  • Max. Bundle Dia. 2nd Hole (in): 5
  • Min. Bundle Dia. (in): 5
  • Operating Temp.: -40 to 221F (-40 to 105C)
  • Panel Thickness (in): 0.07 - 0.51
  • Shape: Round
  • Width (in): 1.06
QTY